High-precision system for TLM contact resistance, sheet resistance, and Ag line resistivity on wafers up to 230 × 230 mm. Features a 14-pin Au/BeCu probe head with customizable layouts, full noise immunity, and smooth X-Y-Z motion. Includes a vacuum chuck for secure samples and shielded cabling for reliable signal integrity. Ideal for semiconductor fabs, PV, and R&D labs.