Poly Thickness Reduction via Laser Abl/ Laser Induced Oxidation
This TOPCon cell development equipment utilizes ultrafast laser ablation to precisely remove the rear-side PSG layer, followed by controlled wet etching to thin the polysilicon layer. By minimizing parasitic light absorption at the rear polysilicon interface, the process significantly enhances optical performance while reducing material usage. This dual optimization enables lower manufacturing costs and improved cell efficiency, making it an ideal solution for next-generation high-efficiency TOPCon solar cell production.

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