This system leverages the anisotropic alkali reaction of silicon to form uniform pyramid structures on wafer surfaces, enhancing light- trapping for higher solar cell efficiency. The process flow includes Rough Polishing → Pre-cleaning → Texturing → Post-cleaning (O₃ compatible) → Pickling → Pre-dehydration → Drying. Features include adjustable etching depth, support for MES and RFID, optional online weighing, one-key cleaning, online slot replacement, and adjustable process tank circulation for simple, efficient operation and optimized wafer processing.