This technology uses a highly precise laser process to selectively remove the passivation layer on the surface of silicon wafers, enabling optimized metal contact and significantly reduced contact resistance. By improving electrical connection quality, it effectively enhances the conversion efficiency of solar cells. The system is fully compatible with advanced manufacturing processes, including TOPCon, xBC, half-cell, three- cell, and 0BB architectures, making it ideal for next- generation high-efficiency photovoltaic production.